銅(Cu)

規(guī)格：

高純銅：99.999% Cu-5N-I-35

      檢測(cè)雜質(zhì)：Ag, Bi, Co, Fe, Zn, Mg, Ni, Pb, Sb, Sn, Mn

      雜質(zhì)總含量：≤10ppm

      高純銅：99.9999% Cu-6N-I-36

      檢測(cè)雜質(zhì)： Bi, Co, Fe, Zn, Mg, Ni, Pb, Sb, Sn, Mn

      雜質(zhì)總含量：≤1ppm

用途：主要用于制備電子元器件、電訊工業(yè)用的大型電子管、高級(jí)特種合金、氧化銅整流元件、超微型變壓器繞組以及金屬分析標(biāo)樣。

包裝：滌綸薄膜包裝后雙層復(fù)合膜真空封裝或直接玻璃管真空封裝。

Specification:
High purity Cu: 99.999% Cu-5N-I-35
Testing impurity: Ag, Bi, Co, Fe, Zn, Mg, Ni, Pb, Sb, Sn, Mn
Total impurity content: ≤10ppm
High purity Cu: 99.9999% Cu-6N-I-36
Testing impurity: Bi, Co, Fe, Zn, Mg, Ni, Pb, Sb, Sn, Mn
Total impurity content: ≤1ppm
Application: Copper is primarily used in the manufacture of electronic devices and elements, large scale electron tubes in telecommunication industry alloys in high grade, copper oxide rectifying elements, super-miniature transformer windings and as calibration speciments in metal analyses.
Package: Packed with terylene film, and double poly-film with vacuum encapsulation. Packed with glass tube with vacuum encapsulation directly.